This March, Atherm will attend one more time the Advanced Technology Workshop on Micropackaging and Thermal Management, at La Rochelle (France).
The 19th edition of this workshop organised by the International Microelectronics and Packaging Society Europe (IMAPS Europe) will bring to light many thermal management topics and solutions
directly related to our 30+ year-long expertise. So, please feel free to meet our team or to contact us upfront if you are seeking for solutions in any of the following topics:
• Cooling solutions for electronics packaging
• Heatsinks, heat pipes
• Liquid and phase change cooling
• Thermal modelling and simulation
• Innovative cooling solutions
• Thermal management of optoelectronics components (LEDs, IR sensors…)
On our stand you will see several of our realizations designed and manufactured for major French or international clients in the field of power electronics, automotive or avionic transport, defence, etc.
It will be a pleasure to learn more about your needs and discuss how our customized solutions can meet them, whether it is using liquid cold plates (including the cold plates made by using the FSW
technology), heat pipes systems, or heat sinks. Please note that our cooling systems can be electrically insulated, if needed.
Please feel free to meet our team or to contact our CEO Thomas Albertin upfront to schedule a meeting.