Atherm will attend the 18 th European advanced technology workshop on micropackaging and thermal management, held at La Rochelle (France) on March 26 and 27.
The workshop, organised by the International Microelectronics and Packaging Society Europe (IMAPS Europe), has grown over the years to the number of presented works and attendees. It will focus on a variety of thermal management solutions for microelectronics packaging, including innovative cooling solutions.
Since 1988, Atherm has been seeking to answer pressing thermal challenges. We successfully tackled the development of many efficient and reliable demanding cooling solutions and increasingly complex devices.
It will be a pleasure to learn more about your needs and discuss how our customized solutions can meet them, in particular our cold plates, produced by FSW.