Atherm will be present at the 17th European advanced technology workshop on micropackaging and thermal management, at La Rochelle (France) on January 31st and February 1st.
The workshop, organised by the International Microelectronics and Packaging Society (IMAPS), will focus on improvements in thermal management materials, components, and systems dedicated to innovative packaging and cooling solutions for various systems and devices, such as highly integrated power, RF, and microwaves.
As an expert in thermal management, Atherm is aware that current thermal challenges – increases in functionality, complexity, miniaturisation, operating temperature, and power output – require advances in thermal solutions so that we can continue to guarantee reliability. It will be a pleasure to learn more about the needs of our market and to show how our customized solutions can be used to meet them, in particular through cold plates, produced by FSW.